Integrated circuit electromagnetic compatibility and countermeasures related analysis (2) - Integrat
ESD refers to the charge transfer phenomenon between two objects at different potentials due to direct contact or electrostatic field induction. In electronic devices, ESD can cause damage to sensitive electronic components, so improving ESD immunity is essential to ensure the normal operation of electronic devices. Preventive measures can increase ESD immunity to about 15kV, which shows that through reasonable design and protection, the impact of ESD on the electronic module can be effectively reduced
二、ESD problem countermeasures
ESD testing can only be done on finished parts, because only after the entire part has been developed and produced can its ESD immunity in the actual working environment be accurately assessed. This also means that ESD protection measures need to be planned and considered in advance during the product development process to avoid increased costs and time delays caused by problems during the testing phase.
1, improve the IC design: IC manufacturers can improve their ESD immunity by improving the design of the IC. For example, adopting more advanced ESD protection technology, optimizing circuit layout and adding ESD protection devices. This can reduce the probability of ESD failure to some extent, but requires a lot of research and investment in the IC design and manufacturing process.
2, optimize the mechanical structure design: Taking appropriate EMC preventive measures in the mechanical structure design can also reduce the impact of ESD on integrated circuits. When ESD interference originates from the heat sink and acts directly on the IC housing, changing the mechanical design is an effective way to solve the problem. This may include redesigning the structure, location, or material of the heat sink to reduce its interference with the IC. However, this method requires changes in mechanical structural components and production tools, which is costly. Therefore, in the early stages of product design, understanding the electromagnetic compatibility characteristics of ics and taking appropriate preventive measures can avoid such problems in the later stages, thereby reducing costs and shortening the development cycle.
3, increase the shielding: the integrated circuit (IC) around the increase of shielding cover, filter circuit, etc., to reduce the coupling and propagation of electromagnetic interference. This requires full consideration of EMC issues at the design stage and close cooperation with electronic designers.

Figure 3 Vulnerability areas of the microcontroller detected by the source
For example, in order to improve ESD immunity, a shield can be set above the IC to intercept the electric field emitted by the heat sink (as shown in Figure 3), and the shield must also be extended to the quartz crystal during electrostatic discharge (ESD) testing. Thus, ESD immunity is increased to about 15kV. However, it is important to note that other weak points in the IC may limit further immunity enhancement, as interference may still be coupled to the IC through the line network. Therefore, in the design of electronic equipment, various factors need to be considered comprehensively, and can not only rely on the shield layer to solve the electromagnetic compatibility problem.
If the IC external need to increase ESD diode protection, you can contact Shanghai Leimo sales staff or EMC brother.

3, strengthen testing and evaluation: In order to ensure the EMC performance of the IC, it is necessary to conduct rigorous testing and evaluation. This includes ESD testing, electromagnetic compatibility testing, etc., to verify the performance and reliability of integrated circuits in various electromagnetic environments. Through testing, problems can be found in time and corresponding improvement measures can be taken to improve the quality and stability of integrated circuits.
The next article will then share "Integrated circuit ESD testing and evaluation", welcome your attention.
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