smart home
2.6 Smart speaker
Smart Speaker
Overview of the plan:
Smart speaker generally consists of power module, voice recognition module, WIFI module, master chip, memory module, etc. The key features of Smart speaker include voice interaction, content sharing, Internet services and smart home control.
Smart speaker integrate many Technological convergence, such as acoustic design, wireless technology, speech recognition, far field pickup, semantic analysis, etc. Compared with thousands of ordinary Bluetooth speakers, they are supported by more advanced technologies in both hardware and software systems.
Industry hotspots:
Microphone array technology uses thousands of voice signal processing to filter the received sound waves, which plays the role of noise suppression, echo elimination, and reverberation removal. The overall market size of consumer grade MEMS microphones is expected to grow from $1.7 billion in 2019 to nearly $2.1 billion in 2023, with a CAGR of over 5%.
MEMS silicon microphones use MEMS technology to replace traditional ECM, with advantages such as high accuracy, high sensitivity, long service life, high stability, and economic benefits. In the field of consumer electronics, many domestic manufacturers have already done quite well, with companies such as VOA, Senson, and Light and Dark Sensing all playing important roles.
Recommended products for Smart speaker：
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Category |
Brand |
Product and product overview |
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FPGA Field Programmable Logic Array |
Jingwei Qili Technology Co., Ltd |
HRO3PNO: number of series HM E-R logic pieces: 3072 4-input look-up tables, 2048 DFF registers Maximum clock frequency: 400MHz |
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FLASH memory |
Xinlian Microtechnology |
XL2SQ128-SOP8(208mil); Power voltage： 1.65V-1.95V Capacity: 128Mbit |
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Xinlian Microtechnology |
XL2SQ80-TSSOP8; Power voltage: 2.7V3.6V Capacity: 8Mbit |
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Voice chip |
Nine core electronics |
NRK3301: High performance 32-bit RISC core, main frequency 240MHz VDDIO2.2V 3.6V RKM 3301 RKM 3302 with different pin packages |
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Nine core electronics |
NRK3301: High performance 32-bit RISC core, main frequency 240MHz VDDIO2.2V 3.6V RKM 3301 RKM 3302 with different pin packages |
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Nine core electronics |
NRK2202: Working voltage range: 2.973.63V bar: 300 |
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Voice chip |
Weichuang Zhiyin |
WT2003H4-24SS: Working voltage 2.2-5.5V, frequency: 120MHz |
|
WiFi-SOC |
Lianshengde Microelectronics battery |
WB00: Processor type: Integrated 32-bit XT804 Processor frequency: 240MHz |
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Battery |
Chuangming Battery |
18650F9M: LGDBMH11865 model replacing LG, Nameplate capacity: 3200mAh, rated voltage: 3.6V |
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Chuangming Battery |
18650F8P: replace Sam Sung's INR18650-25R model, with Nameplate capacity 2500mAh, rated voltage: 3.6v |
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Audio power amplifier |
Material Mountain Core Creation |
COS5532-S0P8: Working voltage: 2.518V, static current: 2.8mA |
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SANO Microelectronics |
MIX2002: Supply voltage VDD: -0.36V, output voltage VI: -0 3 VDD+0 3V |
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Silicon wheat |
Gongda electroacoustic |
MA-HFA381-H13-4F: Sensitivity: -381dB, Current： 110µA |
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Gongda electroacoustic |
MDN-ARA273-A10: Sensitivity: -273dBFS, Current: 650µA |
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Silicon wheat |
Sensitive core micro |
MSM38A2718Z9EM3 sensitivity: -41-35dB, power supply voltage: 1.5-3.6V |
|
Ming Di Sensing |
dmi2718; Dmi2718: Battery voltage1.62V 3.6V |
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TVS Diode |
Leiditech |
For power supply：SMBJ24CA package SMB,24V VRWM,15.4A IPP
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ESD Diode |
Leiditech |
For storage cards：LC0504F package SOT-363 IEC 61000-4-2 (ESD) Air discharge: ±15kV Contact discharge: ±8kV,5V VRWM，5A IPP
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ESD Diode |
Leiditech |
For WIFI：ULC0511CDN package DFN1006, –IEC 61000-4-2 (ESD) ±30kV，5V VRWM，4.5A IPP
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ESD Diode |
Leiditech |
For HDMI：ULC0544P10 package DFN2510P10 IEC 61000-4-2 (ESD) Air discharge: ±30kV Contact discharge: ±25kV,5V VRWM，5A IPP |
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ESD Diode |
Leiditech |
For USB2.0 interface：SR05 package SOT-143 IEC 61000-4-2 (ESD) ±20kV,5V VRWM，3A IPP
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ESD Diode |
Leiditech |
For button：SDA05W5 package SOT-353 IEC 61000-4-2 (ESD) Air discharge: ±30kV Contact discharge: ±25kV,5V VRWM，6A IPP
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